Warpage, glass fragility, and hybrid-bond stress are now the binding constraints on advanced AI and HPC package scaling, not interconnect density.
Key Takeaways
Warpage underlies most advanced packaging failures; CTE mismatch between organic substrates and silicon worsens as package sizes and layer counts grow.
Glass carriers reduce warpage and improve dimensional stability, but introduce brittleness and edge-damage failure modes that conventional tests miss.
Hybrid bonding yield transitions from defect-driven to stress-driven below 2-3 micron pitch as copper density increases mechanical stress at the interface.
NVIDIA’s Sandeep Razdan at iMAPS: system architecture is the performance driver today, making the package a core performance variable, not a passive shell.
Substrate shortages reflect uncertainty about which platforms can still scale mechanically and economically for next-generation AI packages, not just supply constraints.
